This comes in the wake of geopolitical uncertainty in the region. In related news, Intel CEO Pat Gelsinger speaking at the Fortune Brainstorm Tech conference, stressed on the importance for American chip designers to seek out semiconductor manufacturing in America, and cautioned against investing in Taiwan (without naming TSMC). N3 will play a vital role with logic/compute tiles in products bound for 2023, as N3 hits critical volume in the first half of the year. As part of its IDM 2.0 strategy, Intel has decided to build its products essentially as multi-chip modules with each block of IP built on a silicon fabrication node most optimal to it, so the company maximizes cutting-edge foundry nodes only on the technology that benefits from it the most. The company is sending an executive delegation to meet with TSMC later this month, to secure foundry capacity for the N3 (3 nm) silicon fabrication node, and ensure that Intel's allocation isn't affected by other customers such as Apple. Intel is reportedly in talks with TSMC to secure foundry allocation to meet its product roadmap execution.
However, UMC is starting to feel the pressure from its competitors in China, as the PRC government is making a push for local production of local IC designs. The company has done well in this niche, with a revenue of about US$6.2 billion in 2020. Until 2018, UMC was competing head on with TSMC, although the company was always about a node behind TSMC, which led to a management team decision to slow down its node transition and instead to focus on speciality technologies. Taiwanese UMC is one of the foundries that makes many of the automotive semiconductors, as well as key components when it comes to power regulation and is considered the world's third largest foundry.
The chip shortage discussion has been very focused on TSMC for some reason and although the company is without a doubt the world's leading foundry, the company is making its living from being a cutting edge foundry, whereas much of the components that there's a shortage of are made on far older nodes at many different foundries. In addition, golden trims on 4 of the edges highlight the luxurious look of the cube. Each panel is mounted on snap pins for tool-less removal. At the bottom, two anodized and brushed aluminium panels with large mesh openings complete the frame of the Regis. The addressable RGB can be controlled via the case button, or synchronized with any motherboard software. The REGIS has 3-sided black tinted tempered glass panels, two sides for displaying the system, and the front for featuring an infinity mirror addressable RGB which uses an ultra-thin lighting module. ATX motherboard compatible, the REGIS supports up to 336 mm long GPUs and dual 240/280 radiators. The exterior is complemented with black tinted tempered glass panels and two brushed aluminium mesh panels with a touch of gold trim on the edges. This luxury case is uniquely designed with a cube form factor, elevated above the surface by a premium aluminium stand, and has an infinity mirror addressable RGB front panel. AZZA, a leading brand of computer cases and accessories, introduces the REGIS 902.